Lead-Free Defense Electronics Project
Lead-free electronics – materials and processes with profound consequences
Materials applied at the microscopic level on commonly used subcomponents critical to the functions of sophisticated defense systems in diverse, challenging environments throughout – and beyond – the planet.
The DEC lead-free team has the deep industry knowledge, innovative research capabilities, and leading-edge facilities required to successfully migrate to lead-free defense electronics.
years experience transitioning lead-free solders from lab to product.
lead-free alloys from consortia and projects for gap analysis.
fully provisioned with equipment and materials required for microelectronics research.
capable of simulating extreme temperature high impact use scenarios.
individually and through PERM, including BAE, Boeing, Collins Aerospace, Honeywell, L3Harris, Lockheed Martin, Northrup Grumman, Raytheon, and Draper
The project team is led by Purdue University, the University of Maryland and Auburn University. The team has access to IPC’s 3,000 members for insight into industry standards and channels for information exchange and tech transfer.